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Sizzix Sizzix Die Brush & Foam Pad For Wafer Thin Dies

Product Code: 660513
  • Now £6.29
  • Was £6.99
  • |
  • Save £0.70 (10%)
Item out of Stock | Usually dispatched within 24 hours
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Sizzix Die Brush & Foam Pad For Wafer Thin Dies. Per pack
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix die brush does it easily and ergonomically.
With a sleek
ergonomic rubber-grip handle for non-slippage and easy manoueverability
the die brush easily rolls away excess paper to reveal the perfect cut!
The die brush includes a foam pad that acts as the perfect work surface for removing excess paper from the dies and even the cut-out."

Please contact us for more information

Please contact us for more information

15% off your next order When you sign up to our newsletter!
Free delivery When you spend over £40!
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