Sizzix Die Brush & Foam Pad For Wafer Thin Dies. Per pack
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix die brush does it easily and ergonomically. With a sleek ergonomic rubber-grip handle for non-slippage and easy manoueverability the die brush easily rolls away excess paper to reveal the perfect cut! The die brush includes a foam pad that acts as the perfect work surface for removing excess paper from the dies and even the cut-out."